Etch Hard Mask Film
Etch hard mask film materials is strongly required for wafer patterning below 70nm device.
1-Hexene and Propylene are deposited by CVD(Chemical Vapor Deposition) equipment and
it forms ACL(Amorphous Carbon Layer). These hard mask have high etch resistance from
high carbon content, it helps to define micro pattern on wafer.
| Product |
Structure |
Property |
MSDS |
| 1-Hexene |
 |
Molecular Formula
Molecular Weight
Boiling Point
Vapor Pressure
Physical State/Color
Water Reactivity |
: C6H12
: 84.16g/mol
: 60~66℃
: 21℃/155torr
: Colorless liquid
: Stable |
|
| Propylene |
 |
Molecular Formula
Molecular Weight
Boiling Point
Vapor Pressure
Physical State/Color
Water Reactivity |
: C3H6
: 42.08g/mol
: -47℃
: 37℃/15.4atm
: Colorless Gas
: Stable |
|
| 4MS |
|
Molecular Formula
Molecular Weight
Boiling Point
Vapor Pressure
Physical State/Color
Water Reactivity
|
: C4H12Si
: 88.22g/mol
: 26~28℃
: -
: Colorless liquid
: Stable
|
|
| 3MS |
|
Molecular Formula
Molecular Weight
Boiling Point
Vapor Pressure
Physical State/Color
Water Reactivity
|
: C3H10Si
: 74.20g/mol
: 6.7℃
: -
: Colorless Gas
: Stable
|
|
