Home > Products > Semiconductor Material > Gap Fill Material
Gap Fill Materials
Semiconductor device requires dielectric materials for isolation on STI(Shallow Trench Isolation), IMD(Inter-Metal Dielectric), and PMD(Pre-Metal Dielectric).
For this process CVD(Chemical Vapor Deposition) and HDP(High Density Plasma) was usually used, but it started forming void inside STI as memory density is getting high.
To make uniform and void-free gap-filling, SOD(Spin on Dielectric) is used for devices below 45nm.
Product
Structure
Property
MSDS
PS
Molecular Formula
Molecular Weight
Melting Point
Vapor Pressure
Physical State/Color
Water Reactivity
