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Low-k

Decreasing feature size in semiconductor device causes problems of RC delay and Cross talk, it makes Total Signal Delay Time. Thus, it is very important to decrease RC delay for high density and high speed performance of device. Low-k material is strongly required for inter-layer dielectric.

Low-k

Product Structure Property MSDS
DMTMDSO Molecular Formula
Molecular Weight
Boiling Point
Density
Physical State/Color
Water Reactivity
: C6H18O3Si2
: 194.38g/mol
: 139¡É
: 0.9048g/ml
: Liquid/Colorless
: Slowly decompose
DMDMOS Molecular Formula
Molecular Weight
Boiling Point
Density
Physical State/Color
Water Reactivity
: C4H12O2Si
: 120.23g/mol
: 81.4¡É
: 0.864g/ml
: Liquid/Colorless
: Slowly decompose
OMCTS Molecular Formula
Molecular Weight
Boiling Point
Vapor pressure
Density
Physical State/Color
Water Reactivity
: C8H24O4Si4
: 296.62g/mol
: 175¡É
: 21.7¡É/1torr
: 0.955g/ml
: Liquid/Colorless
: Decomposition
TPOSL Molecular Formula
Molecular Weight
Boiling Point
Vapor pressure
Density
Physical State/Color
Water Reactivity
: CH3CH2C(CH3)O)3SiOH
: 306.51g/mol
: 97¡É/2.5torr
: 85¡É/0.63torr
: 0.944g/ml
: Liquid/Colorless
: React slowly
TMCTS Molecular Formula
Molecular Weight
Boiling Point
Vapor pressure
Density
Physical State/Color
Water Reactivity
: C4H16Si4O4
: 240.51g/mol
: 135¡É
: 20¡É/7torr
: 0.986g/ml
: Liquid/colorless
: React slowly