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Metallization Metal
Metal deposition process has been changed from PVD(Physical Vapor Deposition) to CVD(Chemical Vapor Deposition)/ALD(Atomic Layer Deposition) because of scaling down on semiconductor device.
It makes metal precursors be changed either. Alpis-3 and MABOC are CVD/ALD metal precursors developed by DNF following roadmap.
* Metallization Metal Materials change : W(Resistivity 8.0 μΩ-cm) → Al(2.7 μΩ-cm) → Cu(1.7 μΩ-cm)
* Metal Deposition process change : PVD → CVD → ALD
Product
Structure
Property
MSDS
Alpis-3
Molecular Formula
Molecular Weight
Melting Point
Boiling Point
Vapor Pressure
Physical State/Color
Water Reactivity